{"id":746,"date":"2025-06-19T15:00:10","date_gmt":"2025-06-19T06:00:10","guid":{"rendered":"http:\/\/www-dsc.naist.jp\/dsc_consortium\/?p=746"},"modified":"2025-11-14T15:34:53","modified_gmt":"2025-11-14T06:34:53","slug":"dsc%e7%a0%94%e7%a9%b6%e6%8e%a8%e9%80%b2%e3%83%88%e3%83%bc%e3%82%af-202506","status":"publish","type":"post","link":"http:\/\/www-dsc.naist.jp\/dsc_consortium\/dsc%e7%a0%94%e7%a9%b6%e6%8e%a8%e9%80%b2%e3%83%88%e3%83%bc%e3%82%af-202506\/","title":{"rendered":"DSC\u7814\u7a76\u63a8\u9032\u30c8\u30fc\u30af 202506"},"content":{"rendered":"<p><span style=\"font-family: georgia, palatino, serif;\"><span style=\"font-size: 12pt;\">6\u6708\u306e\u5b66\u5185\u5171\u540c\u7814\u7a76\u4fc3\u9032\u30c8\u30fc\u30af\u306f\u3001\u8a08\u6e2c\u30a4\u30f3\u30d5\u30a9\u30de\u30c6\u30a3\u30af\u30b9\u7814\u7a76\u5ba4\u306e\u8d64\u702c\u5584\u592a\u90ce\u5148\u751f\u306b\u3054\u8b1b\u6f14\u3044\u305f\u3060\u304d\u307e\u3057\u305f\u3002<\/span><\/span><\/p>\n<p><span style=\"font-family: georgia, palatino, serif;\">\u30bf\u30a4\u30c8\u30eb\u3068\u6982\u8981\u306f\u4ee5\u4e0b\u306b\u306a\u308a\u307e\u3059\u3002<\/span><\/p>\n<p><span style=\"font-family: georgia, palatino, serif; font-size: 12pt;\">==================== <\/span><\/p>\n<p>\u8d64\u702c \u5584\u592a\u90ce \u7279\u4efb\u51c6\u6559\u6388\uff08\u8a08\u6e2c\u30a4\u30f3\u30d5\u30a9\u30de\u30c6\u30a3\u30af\u30b9\u7814\u7a76\u5ba4\uff09<\/p>\n<p>TITLE:<br \/>\nDevelopment of High-Precision Multimodal Analysis for Next-Generation Semiconductor Devices through Non-Rigid Registration of Heterogeneous 3D Microscopy Data<\/p>\n<p>ABSTRACT\uff1a<br \/>\nAs semiconductor devices continue to advance, achieving greater energy efficiency and higher performance, their structures are becoming increasingly miniaturized and complex in three dimensions. This evolution necessitates precise analysis of the 3D distribution of trace impurities which have a significant impact on device functionality. However, due to trade-offs, no single analytical method can simultaneously provide both high detection sensitivity and spatial resolution. To overcome this limitation, we propose a multimodal analysis method that integrates heterogeneous microscopic data from Three-dimensional atom probe tomography (3DAP) and electron tomography (ET), utilizing non-rigid registration techniques. This approach is designed to achieve both high detection sensitivity and spatial resolution. We evaluated the proposed methodology using simulated and model datasets, confirming its feasibility and highlighting key technical challenges for future development.<\/p>\n<p><span style=\"font-size: revert; color: initial;\">and cycle labeling, with AI-based prediction planned for future implementation. A current model has achieved 84% accuracy, and further improvements and international pilot testing are underway.<\/span><\/p>\n","protected":false},"excerpt":{"rendered":"<p>6\u6708\u306e\u5b66\u5185\u5171\u540c\u7814\u7a76\u4fc3\u9032\u30c8\u30fc\u30af\u306f\u3001\u8a08\u6e2c\u30a4\u30f3\u30d5\u30a9\u30de\u30c6\u30a3\u30af\u30b9\u7814\u7a76\u5ba4\u306e\u8d64\u702c\u5584\u592a\u90ce\u5148\u751f\u306b\u3054\u8b1b\u6f14\u3044\u305f\u3060\u304d\u307e\u3057\u305f\u3002 \u30bf\u30a4\u30c8\u30eb\u3068\u6982\u8981\u306f\u4ee5\u4e0b\u306b\u306a\u308a\u307e\u3059\u3002 ==================== \u8d64\u702c \u5584\u592a\u90ce \u7279\u4efb\u51c6\u6559\u6388\uff08\u8a08\u6e2c\u30a4\u30f3\u30d5\u30a9\u30de\u30c6 [&hellip;]<\/p>\n","protected":false},"author":4,"featured_media":0,"comment_status":"closed","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"_bbp_topic_count":0,"_bbp_reply_count":0,"_bbp_total_topic_count":0,"_bbp_total_reply_count":0,"_bbp_voice_count":0,"_bbp_anonymous_reply_count":0,"_bbp_topic_count_hidden":0,"_bbp_reply_count_hidden":0,"_bbp_forum_subforum_count":0,"footnotes":""},"categories":[6,7],"tags":[],"class_list":["post-746","post","type-post","status-publish","format-standard","hentry","category-seminar","category-active"],"acf":[],"_links":{"self":[{"href":"http:\/\/www-dsc.naist.jp\/dsc_consortium\/wp-json\/wp\/v2\/posts\/746"}],"collection":[{"href":"http:\/\/www-dsc.naist.jp\/dsc_consortium\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"http:\/\/www-dsc.naist.jp\/dsc_consortium\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"http:\/\/www-dsc.naist.jp\/dsc_consortium\/wp-json\/wp\/v2\/users\/4"}],"replies":[{"embeddable":true,"href":"http:\/\/www-dsc.naist.jp\/dsc_consortium\/wp-json\/wp\/v2\/comments?post=746"}],"version-history":[{"count":3,"href":"http:\/\/www-dsc.naist.jp\/dsc_consortium\/wp-json\/wp\/v2\/posts\/746\/revisions"}],"predecessor-version":[{"id":749,"href":"http:\/\/www-dsc.naist.jp\/dsc_consortium\/wp-json\/wp\/v2\/posts\/746\/revisions\/749"}],"wp:attachment":[{"href":"http:\/\/www-dsc.naist.jp\/dsc_consortium\/wp-json\/wp\/v2\/media?parent=746"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"http:\/\/www-dsc.naist.jp\/dsc_consortium\/wp-json\/wp\/v2\/categories?post=746"},{"taxonomy":"post_tag","embeddable":true,"href":"http:\/\/www-dsc.naist.jp\/dsc_consortium\/wp-json\/wp\/v2\/tags?post=746"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}